Product Selector

Filters

Product Type
Product Dimension
Product Dimension - slider
0mm100mm
storage temperature(°C)
storage temperature(°C) - slider
-60°C200°C
Protocol
Inlay Substrate
Product Dimension
Product Dimension - slider
0mm100mm
Protocol
storage temperature(°C)
storage temperature(°C) - slider
-60°C200°C
Inlay Substrate

Products


  • Die Cut Size : 30 x 45 / 52 x 52
    Frequency : HF
    RFID Chip : NXP / LEGIC / TI
    Applications : Retail/Branding
    Features : Tamper Proof

  • Dimensions (mm) : D 50 x T 1.6
    Frequency : LF
    RFID Chip : EM4450
    Applications : Industrial
    Features : High Temperature Resistant
    • Die Cut Size : 18 x 35
    • Frequency : HF
    • RFID Chip : NXP ICODE SLIX
    • Applications : NFC
    • Features : On-metal Reading/Roll to Roll

  • Die Cut Size : 29 x 29
    Frequency : HF
    RFID Chip : NXP NTAG213
    Applications : NFC
    Features : Roll to Roll

  • Dimensions (mm) : D 50 x T 1.1
    Frequency : LF/ HF
    RFID Chip : NXP ICODE SLIX / EM4102 / EM4200 / LEGIC MIM1024 / Fujitsu MB89R118
    Features : Waterproof

  • Dimensions (mm) : OD 20 x ID 3 xT 1.6
    Frequency : LF
    RFID Chip : EM4200
    Applications : Industrial
    Features :

  • Die Cut Size : 26.5 x 42
    Frequency : HF
    RFID Chip : NXP / Sony Felica / TI
    Applications : NFC
    Features : Roll to Roll
    • Die Cut Size : Ø35 (center hole 16 mm) / Ø38 (center hole 16 mm)
    • Frequency: LF / HF
    • RFID Chip : EM4102 NXP ICODE SLIX
    • Features : Tamper Proof